The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Nov. 30, 2010
Donald C Abbott, Norton, MA (US);
Donald C Abbott, Norton, MA (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device without cantilevered leads uses conductive wires () to connect the chip terminals to the leads (), and a package compound () to encapsulate the chip surface () with the terminals, the wires, and the lead surfaces with the attached wires. The chip surface () opposite the terminals together with portions () of the chip sidewalls protrude from the package, allowing an unimpeded thermal contact of the protruding chip surface to a substrate () to optimize the thermal flux from the chip to the substrate. Solder bodies () attached to the compound-free lead surfaces () can be connected to the substrate so that the solder bodies are as elongated as the protruding chip height, facilitating the void-free distribution of an underfill compound into the space between chip and substrate, and improving the absorption of thermomechanical stresses during device operation.