The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Jun. 26, 2009
Applicants:
Hyoung Soon Yune, Seoul, KR;
Yeong Bae Ahn, Cheongju-si, KR;
Inventors:
Hyoung Soon Yune, Seoul, KR;
Yeong Bae Ahn, Cheongju-si, KR;
Assignee:
Hynix Semiconductor Inc., Icheon-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device including a CMP dummy pattern and a method for manufacturing the same are provided. The warpage of a wafer can be prevented by forming the CMP dummy pattern in the same direction and/or at the same angle as a pattern of a cell region. Accordingly, overlay error caused by etching residues is reduced, thereby improving the yield of the semiconductor device.