The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8242519 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 14, 2012

Filed:

Jun. 14, 2010
Applicants:

Jian Shihn Tsang, Taipei County, TW;

Wen Liang Tseng, Hsinchu, TW;

Yao Te Tseng, Hsinchu County, TW;

Shih Hsiung Chan, Hsinchu County, TW;

Inventors:

Jian Shihn Tsang, Taipei County, TW;

Wen Liang Tseng, Hsinchu, TW;

Yao Te Tseng, Hsinchu County, TW;

Shih Hsiung Chan, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.


Find Patent Forward Citations

Tsang, Jian. (2012). Package structure of light emitting diode for backlight (U.S. Patent No. 8242519). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8242519

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