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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8242378 B1

PDFFull Text
Date of Patent:
Aug. 14, 2012

Filed:

Sep. 21, 2007

Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an ni layer which has a low concentration of p, wherein the amount of p in the underlying ni layer is controlled as a function of the expected volume of the solder mass

Applicants:

Ahmed Amin, Allentown, PA (US);

Frank Baiocchi, Allentown, PA (US);

John Delucca, Montgomery, PA (US);

John Osenbach, Kutztown, PA (US);

Brian T. Vaccaro, Mertztown, PA (US);

Inventors:

Ahmed Amin, Allentown, PA (US);

Frank Baiocchi, Allentown, PA (US);

John Delucca, Montgomery, PA (US);

John Osenbach, Kutztown, PA (US);

Brian T. Vaccaro, Mertztown, PA (US);

Assignee:

Agere Systems Inc., Allentown, PA (US);

Attorney:

Ryan, Mason & Lewis, LLP

Primary Examiner:

Randy W Gibson

Int. Cl.
CPC ...
H05K 1/09 (2006.01); B23K 31/02 (2006.01); B23K 1/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.

Find Patent Forward Citations

Amin, Ahmed. (2012). Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an ni layer which has a low concentration of p, wherein the amount of p in the underlying ni layer is controlled as a function of the expected volume of the solder mass (U.S. Patent No. 8242378). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8242378

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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