The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Sep. 21, 2007
Ahmed Amin, Allentown, PA (US);
Frank Baiocchi, Allentown, PA (US);
John Delucca, Montgomery, PA (US);
John Osenbach, Kutztown, PA (US);
Brian T. Vaccaro, Mertztown, PA (US);
Ahmed Amin, Allentown, PA (US);
Frank Baiocchi, Allentown, PA (US);
John Delucca, Montgomery, PA (US);
John Osenbach, Kutztown, PA (US);
Brian T. Vaccaro, Mertztown, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.