The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Jul. 13, 2010
Applicants:

Ming-sheng Leu, Hsinchu County, TW;

Chun-kai Liu, Taipei, TW;

Jenn-dong Hwang, Hsinchu, TW;

Jin-bao Wu, Hsinchu, TW;

Chih-kuang Yu, Chiayi, TW;

Inventors:

Ming-Sheng Leu, Hsinchu County, TW;

Chun-Kai Liu, Taipei, TW;

Jenn-Dong Hwang, Hsinchu, TW;

Jin-Bao Wu, Hsinchu, TW;

Chih-Kuang Yu, Chiayi, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.


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