The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Nov. 07, 2009
Hye Sook Shin, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Shan Gao, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Tae Hyun Kim, Seoul, KR;
Young Ki Lee, Gyunggi-do, KR;
Hye Sook Shin, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Shan Gao, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Tae Hyun Kim, Seoul, KR;
Young Ki Lee, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-do, KR;
Abstract
Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.