The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Jan. 12, 2007
Takahiro Kawashima, Osaka, JP;
Tohru Saitoh, Osaka, JP;
Tohru Nakagawa, Shiga, JP;
Hideo Torii, Osaka, JP;
Takahiro Kawashima, Osaka, JP;
Tohru Saitoh, Osaka, JP;
Tohru Nakagawa, Shiga, JP;
Hideo Torii, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
According to a method of the present invention for manufacturing a semiconductor piece, at least two semiconductor layers () are first formed on a substrate () by stacking a sacrificial layer () and the semiconductor layer () on the substrate () in this order and repeating this stacking. Next, the semiconductor layers () are divided into pieces by etching part of the sacrificial layers () and part of the semiconductor layers (). Then, the pieces are separated from the substrate by removing the sacrificial layers ().