The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Nov. 03, 2010
Yong-kwan Lee, Hwaseong-si, KR;
Tae-sung Park, Cheonan-si, KR;
Won-keun Kim, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.