The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8241966 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 14, 2012

Filed:

Aug. 10, 2009
Applicants:

Man-lung Sham, Hong Kong, HK;

Huili Fu, Hong Kong, HK;

Chang-hwa Chung, Hong Kong, HK;

Inventors:

Man-Lung Sham, Hong Kong, HK;

Huili Fu, Hong Kong, HK;

Chang-Hwa Chung, Hong Kong, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defining a shielded space. A vent opening is provided through the substrate and is located in the shielded space for venting the shielded space. A second vent opening may be provided in the top of the conductive enclosure.


Find Patent Forward Citations

Sham, Man-Lung. (2012). Methods of making an electronic component package and semiconductor chip packages (U.S. Patent No. 8241966). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8241966

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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