The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Mar. 06, 2008
Applicants:

Masayoshi Kotake, Chiba, JP;

Yasuhiro Sente, Toda, JP;

Hiroshi Isozumi, Tokyo, JP;

Inventors:

Masayoshi Kotake, Chiba, JP;

Yasuhiro Sente, Toda, JP;

Hiroshi Isozumi, Tokyo, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); H01B 13/00 (2006.01); C09D 11/02 (2006.01); H05K 3/12 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a conductive ink for forming a fine conductive pattern on a substrate by letterpress reverse printing. In particular, the conductive ink enables the pattern to be formed stably without the occurrence of transfer failures and is able to impart superior conductivity by low-temperature baking. The conductive ink, which contains substantially no binder component, comprises as essential components thereof conductive particles having a volume average particle diameter (Mv) of 10 to 700 nm, a release agent, a surface energy regulator and a solvent component, the solvent component being a mixture of a solvent having a surface energy at 25° C. of 27 mN/m or more (high surface energy solvent) and a volatile solvent having a boiling point at atmospheric pressure of 120° C. or lower (low boiling point solvent), and the surface energy of the ink at 25° C. is 10 to 21 mN/m.


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