The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Sep. 08, 2011
Juhyun Lyu, Cheonan-si, KR;
Juhyun Lyu, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Provided are an apparatus and a method for mounting a semiconductor chip. The semiconductor chip mounting apparatus includes a flux reservoir, a flux reservoir moving unit, a wafer support part, a wiring board support part, a transfer head, and a mounting head. The flux reservoir includes an accommodation recess in an upper surface to accommodate flux. The flux reservoir moving unit linearly moves the flux reservoir. The wafer support part is adjacent to a moving path of the flux reservoir and supports a wafer including a semiconductor chip. The wiring board support part is adjacent to the moving path and supports a wiring board. The transfer head picks up and places the semiconductor chip in the accommodation recess. The mounting head picks up the semiconductor chip from the accommodation recess and mounts the semiconductor chip on the wiring board through a surface mount process.