The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Feb. 29, 2008
Akinobu Shibuya, Tokyo, JP;
Koichi Takemura, Tokyo, JP;
Akira Ouchi, Tokyo, JP;
Tomoo Murakami, Tokyo, JP;
Akinobu Shibuya, Tokyo, JP;
Koichi Takemura, Tokyo, JP;
Akira Ouchi, Tokyo, JP;
Tomoo Murakami, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A substrate () and a semiconductor chip () are connected by means of flip-chip interconnection. Around connecting pads () of the substrate () and input/output terminals () of the semiconductor chip (), an underfill material () is injected. The underfill material () is a composite material of filler and resin in which the maximum particle diameter of the filler is 5 μm or below and whose filler content is 40 to 60 wt %. Also, a first main surface of the substrate (), which is not covered with the underfill material (), and the side surfaces of the semiconductor chip () are encapsulated with a molding material (). The molding material () is a composite material of filler and resin whose filler content is over 75 wt % and in which the glass transition temperature of the resin is over 180° C. An integrated body of the substrate () and the semiconductor chip (), which are covered with the molding material (), is thinned from above and below.