The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Jun. 21, 2010
Sean Thorne, Colorado Springs, CO (US);
Scott Popelar, Colorado Springs, CO (US);
Sean Thorne, Colorado Springs, CO (US);
Scott Popelar, Colorado Springs, CO (US);
Aeroflex Colorado Springs Inc., Colorado Springs, CO (US);
Abstract
A flexible semiconductor package is formed by interposing a flexible substrate between a tungsten stiffener and a die. A tungsten stiffener is bonded to a first surface of the flexible substrate prior to flip chip bonding or die attach of a die to a second surface of the flexible substrate. The tungsten stiffener is dimensioned so as to substantially overlap the die and provide a rigid and flat surface on which the die/flexible substrate bonding occurs. The flat and rigid characteristic of a tungsten stiffener optimizes the electrical and mechanical bond between the die and the flexible substrate as well as minimizing CTE mismatch.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile