The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Feb. 27, 2009
Kouichi Saitou, Ogaki, JP;
Yoshio Okayama, Gifu, JP;
Yasuyuki Yanase, Gifu, JP;
Takahiro Fujii, Gifu, JP;
Kouichi Saitou, Ogaki, JP;
Yoshio Okayama, Gifu, JP;
Yasuyuki Yanase, Gifu, JP;
Takahiro Fujii, Gifu, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A semiconductor module includes a device mounting board and a semiconductor device mounted on the device mounting board. The device mounting board includes an insulating resin layer, a wiring layer provided on one main surface of the insulating resin layer, and bump electrodes, electrically connected to the wiring layer, which are protruded from the wiring layer toward the insulating resin layer. The semiconductor device has device electrodes which are disposed counter to a semiconductor substrate and the bump electrodes, respectively. The surface of a metallic layer provided on the device electrode lies on the same plane as the surface of a protective layer.