The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Dec. 08, 2009
Sang-hyun Kim, Seongnam-si, KR;
Shi-yun Cho, Seoul, KR;
Young-min Lee, Yongin-si, KR;
Kyu-sub Kwak, Suwon-si, KR;
Youn-ho Choi, Seoul, KR;
Sang-Hyun Kim, Seongnam-si, KR;
Shi-Yun Cho, Seoul, KR;
Young-Min Lee, Yongin-si, KR;
Kyu-Sub Kwak, Suwon-si, KR;
Youn-Ho Choi, Seoul, KR;
Samsung Electronics Co., Ltd, , KR;
Abstract
A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.