The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Jul. 21, 2008
Yoshikazu Kanemaru, Tokyo, JP;
Takaaki Morita, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheetincludes insulating layersandon one surface of an approximately rectangular substrate, and an electronic componentand a plate-like frame member (member)embedded inside the insulating layer, wherein the plate-like frame membersatisfying the relationship represented by the following formula (1): αand α. . . (1), is mounted on an unmounted portion of the electronic componenton the substrate. In the formula, αand αrespectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component, the plate-like frame member, and the substrate, the respective wiring layers or the respective insulating layers.