The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2012

Filed:

Jul. 20, 2009
Applicants:

Sang-im Yoo, Seoul, KR;

Seung-hyun Moon, Gyeonggi-do, KR;

Geo-myung Shin, Seoul, KR;

Inventors:

Sang-Im Yoo, Seoul, KR;

Seung-Hyun Moon, Gyeonggi-do, KR;

Geo-Myung Shin, Seoul, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); C09D 5/24 (2006.01); B05D 5/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a precursor solution for metal organic deposition includes dissolving an additive-free first precursor composed of a rare earth element, a second precursor comprising barium, and a third precursor composed of copper into an acid to form a compound solution; dissolving the compound solution into a solvent to form a pre-precursor solution; and evaporating the solvent from the pre-precursor solution to form a precursor solution having an increased viscosity; wherein at least one of the first precursor, the second precursor, and the third precursor is dissolved into a fluorine-free acid. A method for forming a superconducting thick film from the above precursor solution includes forming a thick film by a one-time coating of the precursor solution having an increased viscosity onto a biaxially-textured base followed by heat treating to form the superconducting thick film having a thickness of about 0.2 μm or more and having no cracking.


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