The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Sep. 11, 2008
Alfred J. Griffin, Jr., Dallas, TX (US);
Lisa A. Fritz, Dallas, TX (US);
Lin LI, Plano, TX (US);
Lee Alan Stringer, Frisco, TX (US);
Neel A. Bhatt, Allen, TX (US);
John Paul Campbell, Dallas, TX (US);
Stephen Arlon Meisner, Allen, TX (US);
Charles Leighton, Carrollton, TX (US);
Alfred J. Griffin, Jr., Dallas, TX (US);
Lisa A. Fritz, Dallas, TX (US);
Lin Li, Plano, TX (US);
Lee Alan Stringer, Frisco, TX (US);
Neel A. Bhatt, Allen, TX (US);
John Paul Campbell, Dallas, TX (US);
Stephen Arlon Meisner, Allen, TX (US);
Charles Leighton, Carrollton, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
Methods for removing contaminants from a semiconductor device that includes a plurality of aluminum-comprising bond pads on a semiconductor surface of a substrate. A plurality of aluminum-including bond pads are formed on the semiconductor surface of the substrate. A patterned passivation layer is then formed on the semiconductor surface, wherein the patterned passivation layer provides an exposed area for the plurality of bond pads. Wet etching with a basic etch solution is used to etch a surface of the exposed area of the aluminum-including bond pads, wherein the wet etching removes at least 100 Angstroms from the surface of the bond pads to form a cleaned surface.