The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Feb. 20, 2006
Sadahito Misumi, Osaka, JP;
Takeshi Matsumura, Osaka, JP;
Sadahito Misumi, Osaka, JP;
Takeshi Matsumura, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
Provided are a semiconductor device producing method with simple production steps while preventing contamination of a bonding pad and preventing warp generation in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor elementto an adherendthrough an adhesive sheet, and a wire bonding step of wire bonding the elementin the bonding temperatures range of 80 to 250° C. without performing any heating step, wherein, as the adhesive sheet, a sheet having a storage elastic modulus of 1 MPa or more in the temperature range of 80 to 250° C. or a storage elastic modulus of 1 MPa or more at any temperature in the temperature range before curing the sheetis used.