The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8236374 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 07, 2012

Filed:

Mar. 03, 2009
Applicant:

Takami Hikita, Ibaraki, JP;

Inventor:

Takami Hikita, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing an optical waveguide device is provided which provides the excellent smoothness of a light receiving end surface and a light emitting end surface formed by cutting and which provides excellent productivity. A laminate of a film element () and a board () is prepared. The film element () includes at least one future optical waveguide portion. The board () is stacked on the film element (). The laminate is die-cut from the side of the board (). This provides an optical waveguide device including the die-cut board () and an optical waveguide formed thereon. A cutting die used for the die-cutting includes at least blades () for forming the light receiving end surface () and the light emitting end surface () of the optical waveguide. The blades () are flat blades including blade surfaces having an arithmetic means roughness (Ra) of less than 0.02 μm.


Find Patent Forward Citations

Hikita, Takami. (2012). Method of manufacturing optical waveguide device (U.S. Patent No. 8236374). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8236374

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