The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Aug. 23, 2010
Kuang-jung Chen, Hsinchu County, TW;
Shu-tang Yeh, Taichung County, TW;
Ping-i Shih, Chiayi County, TW;
Kung-yu Cheng, Hsinchu, TW;
Jian-lin Wu, Yunlin County, TW;
Kuang-Jung Chen, Hsinchu County, TW;
Shu-Tang Yeh, Taichung County, TW;
Ping-I Shih, Chiayi County, TW;
Kung-Yu Cheng, Hsinchu, TW;
Jian-Lin Wu, Yunlin County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.