The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2012

Filed:

Feb. 26, 2009
Applicants:

Hironori Takahashi, Nagoya, JP;

Hirofumi Hosokawa, Nagoya, JP;

Inventors:

Hironori Takahashi, Nagoya, JP;

Hirofumi Hosokawa, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 47/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A honeycomb structure-forming diehas a die substrateincluding a first plate-shaped memberhaving back holesfor introducing a raw forming material and a second plate-shaped memberhaving slitsfor forming the material into a lattice shape. The first plate-shaped memberhas columnar portionswhere at least a part is zoned by a slit-shaped groove portioncorresponding with a shape of the sliton a bonding face sidewhere the first plate-shaped memberis bonded with the second plate-shaped member. In the columnar portions, the ratio (L/T) of the height L of the columnar portionsto the minimum width T in an end face on the bonding face sideis within 1/3 to 3.5. Thus constituted die realizes high formability, and two plate-shaped members constituting the die substrate are hardly peeled from each other.


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