The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Dec. 21, 2007
Motoaki Tamaya, Chiyoda-ku, JP;
Keiichi Fukuda, Chiyoda-ku, JP;
Shinichi Oe, Chiyoda-ku, JP;
Chise Nanba, Chiyoda-ku, JP;
Akira Nakamura, Chiyoda-ku, JP;
Motoaki Tamaya, Chiyoda-ku, JP;
Keiichi Fukuda, Chiyoda-ku, JP;
Shinichi Oe, Chiyoda-ku, JP;
Chise Nanba, Chiyoda-ku, JP;
Akira Nakamura, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;
Abstract
A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.