The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2012

Filed:

Dec. 25, 2008
Applicants:

Nobuhiro Iwai, Kanagawa, JP;

Yasuhiro Kitajima, Kanagawa, JP;

Kenshi Horihata, Kanagawa, JP;

Kenichi Sato, Miyagi, JP;

Hironori Kikuchi, Miyagi, JP;

Inventors:

Nobuhiro Iwai, Kanagawa, JP;

Yasuhiro Kitajima, Kanagawa, JP;

Kenshi Horihata, Kanagawa, JP;

Kenichi Sato, Miyagi, JP;

Hironori Kikuchi, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H04M 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a mobile wireless device capable of preventing antenna characteristics from degrading by feeding electric power at a position hardly affected by a human body such as a hand or other body part. In the mobile wireless device, a first circuit board () is provided on a first chassis () and has a ground layer; a second circuit board () is provided on a second chassis () and has a ground layer. A ground terminal of a wireless portion () is connected to the ground layer of the first circuit board () at the same voltage level and is also electrically connected through the wireless portion () to a matching circuit (). The ground layer of the second circuit board () is electrically connected to a hinge conducting portion () by electrostatic capacitance coupling. The hinge conducting portion () is connected through a third conduction portion () to a board connection portion () and feeds power to the wireless portion through the matching circuit (). This enables the ground layer of the first circuit board (), the third conduction portion (), the hinge conducting portion (), and the ground layer of the second circuit board () to function as an antenna resonating at a predetermined resonant frequency.


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