The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Aug. 20, 2007
Nobuya Koike, Tokyo, JP;
Atsushi Fujiki, Tokyo, JP;
Norio Kido, Tokyo, JP;
Yukihiro Sato, Tokyo, JP;
Hiroyuki Nakamura, Tokyo, JP;
Nobuya Koike, Tokyo, JP;
Atsushi Fujiki, Tokyo, JP;
Norio Kido, Tokyo, JP;
Yukihiro Sato, Tokyo, JP;
Hiroyuki Nakamura, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device. A first chip is mounted on a first die pad, and a second chip is also mounted on a second die pad. A first die pad and a second die pad do division structure in parallel to the first side and second side of sealing body. As a result, the pin for an output from a first chip and the pin for control of the circuit for a drive can make it able to project from a counter direction, and can set the wiring layout at the time of mounting as the minimum route.