The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2012

Filed:

Aug. 26, 2009
Applicant:

Tsuyoshi Mita, Kanagawa-ken, JP;

Inventor:

Tsuyoshi Mita, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/76 (2006.01); H04R 17/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a liquid ejection head comprising: bonding together a diaphragm made of a stainless steel substrate containing iron, chromium and aluminum, and a pressure chamber formation substrate which has a space for a pressure chamber and is made of stainless steel containing chromium and aluminum, by diffusion bonding, in such a manner that a structural body including the diaphragm and the pressure chamber formation substrate is formed; carrying out a first heat treatment of the structural body so as to form an aluminum oxide film on a surface of the structural body and form a chromium oxide film between the aluminum oxide film and the structural body; forming a lower electrode on the aluminum oxide film; forming a piezoelectric body on a surface of the lower electrode reverse to a surface of the lower electrode on which the chromium oxide film and the aluminum oxide film are formed; forming an upper electrode on a surface of the piezoelectric body reverse to a surface of the piezoelectric body on which the lower electrode is formed; and calcining the piezoelectric body by carrying out a second heat treatment of the diaphragm with which the piezoelectric body is provided.


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