The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Apr. 17, 2008
Applicants:
Akira Chinda, Tokyo, JP;
Nobuaki Miyamoto, Tokyo, JP;
Koki Hirasawa, Kanagawa, JP;
Kenji Uchida, Kanagawa, JP;
Mamoru Mita, Hitachi, JP;
Inventors:
Akira Chinda, Tokyo, JP;
Nobuaki Miyamoto, Tokyo, JP;
Koki Hirasawa, Kanagawa, JP;
Kenji Uchida, Kanagawa, JP;
Mamoru Mita, Hitachi, JP;
Assignees:
Hitachi Cable, Ltd., Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.