The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Feb. 27, 2004
Applicant:
Thilo Stolze, Arnsberg, DE;
Inventor:
Thilo Stolze, Arnsberg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract
The power semiconductor module () comprises several semiconductor components (), located on a substrate (). The aim of the invention is to prevent a reduction in the pressure of the substrate against a cooling surface and the resulting loss of cooling arising from deformations. Said aim is achieved, whereby the substrate () comprises several substrate regions (), with one or several connection regions (), located between substrate regions (), by means of which the substrate regions () are connected such as to move relative to each other.