The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8227709 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 24, 2012

Filed:

Feb. 09, 2010
Applicant:

Daita Tsubamoto, Kawasaki, JP;

Inventor:

Daita Tsubamoto, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-layer printed wiring board includes a first insulating layer, a second insulating layer having a dissipation factor higher than a dissipation factor of the first insulating layer, a first conductive layer, and a first via connected to a lead wire in the first conductive layer. The first via includes a stub extending through the second insulating layer.


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Tsubamoto, Daita. (2012). Printed wiring board, and design method for printed wiring board (U.S. Patent No. 8227709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8227709

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