The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2012

Filed:

Dec. 22, 2009
Applicants:

Dae-hyun Park, Woolsan-si, KR;

Han Kim, Yongin-si, KR;

Kang-wook Bong, Seoul, KR;

Inventors:

Dae-Hyun Park, Woolsan-si, KR;

Han Kim, Yongin-si, KR;

Kang-Wook Bong, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.


Find Patent Forward Citations

Loading…