The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Jan. 17, 2008
Hironori Maruyama, Utsunomiya, JP;
Kensuke Nakamura, Utsunomiya, JP;
Toru Meura, Utsunomiya, JP;
Hiroshi Hirose, Yokohama, JP;
Hironori Maruyama, Utsunomiya, JP;
Kensuke Nakamura, Utsunomiya, JP;
Toru Meura, Utsunomiya, JP;
Hiroshi Hirose, Yokohama, JP;
Sumitomo Bakelite Company, Ltd., Tokyo, JP;
Abstract
A multilayered circuit board of the present invention has a single-side laminated structure and does not include a core substrate having via-holes formed therethrough and vias for providing electrical connection through the via-holes. The multilayered circuit board includes a plurality of pairs of layers, each pair including a conductor circuit layer and an insulator layer, wherein a glass transition temperature of each insulator layer is 170° C. or higher, a coefficient of thermal expansion at the glass transition temperature or lower of each insulator layer is 35 ppm or less, and a modulus of elasticity of each insulator layer is 5 GPa or more.