The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Dec. 12, 2007
Enrico Masarati, Castelnovo Val Tidone, IT;
Enrico Costantini, Ferrara, IT;
Marco Consalvi, Occhiobello, IT;
Enrico Masarati, Castelnovo Val Tidone, IT;
Enrico Costantini, Ferrara, IT;
Marco Consalvi, Occhiobello, IT;
Basell Poliolefine Italia s.r.l., Milan, IT;
Abstract
Filled polyolefin compositions comprising: A) from 15% to 55% by weight of a polypropylene component; B) from 20% to 80% by weight of a filler; C) from 4% to 25% of an elastomeric polymer or polymer composition; wherein the percentages of A), B) and C) are referred to the sum of A) B) and C), and A) is selected from the following compositions: a) a polypropylene composition containing from 20% to 80% by weight of a polypropylene fraction A) having a Melt Flow Rate L (MFR) value of 500 g/10 min. or more, and from 20% to 80% by weight of a polypropylene fraction A) having a Melt Flow Rate L (MFR) value of from 0.1 to 30 g/10 min., the said percentages of A) and A) being referred to the sum of A) and A); or b) a polypropylene composition containing from 15% to 72% by weight of a polypropylene fraction A) having a Melt Flow Rate L (MFR) value of 500 g/10 min. or more, from 15% to 70% by weight of a polypropylene fraction A) having a Melt Flow Rate L (MFR) value of from 0.1 to 30 g/10 min. and from 0.5% to 15% by weight of a compatibilizer Q), the said percentages of A), A) and Q) being referred to the sum of A), A) and Q).