The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Dec. 23, 2009
Satoshi Onai, Ota, JP;
Minoru Akaishi, Ota, JP;
Hiroshi Ishizeki, Ota, JP;
Yoshiaki Sano, Ashikaga, JP;
Satoshi Onai, Ota, JP;
Minoru Akaishi, Ota, JP;
Hiroshi Ishizeki, Ota, JP;
Yoshiaki Sano, Ashikaga, JP;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
SANYO Semiconductor Co., Ltd., Gunma, JP;
Abstract
An object is to prevent a failure, such as a wiring separation or a crack, in an insulating film under a copper wire, in a semiconductor device formed by wire-bonding the copper wire on a portion above the copper wiring. A semiconductor device according to the present invention includes a copper wiring formed above a semiconductor substrate, a plated layer formed so as to cover a top surface and side surfaces of the copper wiring, and a copper wire which is wire-bonded on the plated layer above the copper wiring.