The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2012

Filed:

Nov. 28, 2011
Applicant:

Takuji Tanaka, Tachikawa, JP;

Inventor:

Takuji Tanaka, Tachikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a semiconductor device includes steps of preparing a semiconductor substrate having a first conductive type; implanting a first impurity having the first conductive type in the semiconductor substrate to form a well region having a bottom portion; and implanting a second impurity having a second conductive type in the semiconductor substrate to form an impurity region having a top portion, the top of the impurity region being in contact with the bottom portion of the well region. Implantation of the second impurity includes a first step of implanting the second impurity and a second step of implanting the second impurity, wherein a first implantation area of the first step of implanting the second impurity being broader or narrower than a second implantation area of the second step of implanting the second impurity.


Find Patent Forward Citations

Tanaka, Takuji. (2012). Semiconductor device and method for manufacturing the same (U.S. Patent No. 8227329). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8227329

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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