The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2012

Filed:

May. 01, 2009
Applicants:

Eddy Simoen, Ichtegem, BE;

Jan Vanhellemont, Schilde, BE;

Inventors:

Eddy Simoen, Ichtegem, BE;

Jan Vanhellemont, Schilde, BE;

Assignees:

IMEC, Leuven, BE;

Umicore, Brussels, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/335 (2006.01); H01L 21/322 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for removing impurities from at least one semiconductor device layer during manufacturing of a semiconductor device is disclosed. The semiconductor device layer has a compound semiconductor material and/or germanium. Each heating process performed during the manufacturing of the semiconductor device after provision of the semiconductor device layer has a low thermal budget determined by temperatures equal to or lower than about 900° C. and time periods equal to or lower than about 5 minutes. In one aspect, the method includes providing a germanium gettering layer with a higher solubility for the impurities than the semiconductor device layer. The germanium gettering layer is provided at least partly in direct or indirect contact with the at least one semiconductor device layer, such that impurities can diffuse from the at least one semiconductor device layer to the germanium gettering layer.


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