The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Jul. 28, 2008
Antonius Hendricus Maria Holtslag, Eindhoven, NL;
Evert Jan Van Loenen, Eindhoven, NL;
Georg Sauerlaender, Aachen, DE;
Harald Josef Gunther Radermacher, Aachen, DE;
Matheus Franciscus Antonius Van Hugten, Eindhoven, NL;
Antonius Hendricus Maria Holtslag, Eindhoven, NL;
Evert Jan Van Loenen, Eindhoven, NL;
Georg Sauerlaender, Aachen, DE;
Harald Josef Gunther Radermacher, Aachen, DE;
Matheus Franciscus Antonius Van Hugten, Eindhoven, NL;
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
A method for manufacturing a flooring product with integrated circuitry, comprising the steps of providing a plurality of pieces (), stacking said pieces on top of each other, displaced in relation to each other to form an offset stack (), and compressing said offset stack to form said flooring product. The method further comprises arranging flexible circuitry () on an upper surface of at least one piece, so that, when said pieces are stacked, a first portion () of flexible circuitry on the at least one piece is exposed, said first portion () including circuitry for interacting with the environment. By arranging the circuitry in the flooring during such a manufacturing process, a flooring product is achieved where only a portion of the circuitry is exposed, and another portion is embedded in the flooring. This allows for exposing those parts of the circuitry that are adapted to interact with the surrounding environment, such as optical components, pressure sensitive components, acoustic components, etc.