The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Jun. 25, 2009
Applicants:

Seung Hyun Lee, Gyeonggi-do, KR;

Chan Ki Hwang, Seoul, KR;

Seung Ho Lee, Gyeonggi-do, KR;

Hee Jin Park, Gyeonggi-do, KR;

Inventors:

Seung Hyun Lee, Gyeonggi-do, KR;

Chan Ki Hwang, Seoul, KR;

Seung Ho Lee, Gyeonggi-do, KR;

Hee Jin Park, Gyeonggi-do, KR;

Assignee:

Hynix Semiconductor Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 21/00 (2006.01); H01L 31/0232 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.


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