The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Oct. 21, 2003
Andrew W. Dornbusch, Austin, TX (US);
Charles D. Thompson, Buda, TX (US);
Andrew W. Dornbusch, Austin, TX (US);
Charles D. Thompson, Buda, TX (US);
Silicon Laboratories Inc., Austin, TX (US);
Abstract
An integrated circuit () includes a semiconductor substrate () and an integrated circuit package (). The semiconductor substrate () has a first pair of bonding pads () conducting a differential output signal thereon and adapted to be coupled to an input of a first external filter, and a second pair of bonding pads () conducting a differential input signal thereon and adapted to be coupled to an output of said first external filter. The integrated circuit package () encapsulates the semiconductor substrate () and has first () and second () terminal pairs corresponding and coupled to the first () and second () pairs of bonding pads, respectively. The first () and second () terminal pairs are separated by a first predetermined distance is sufficient to maintain an input-to-output isolation therebetween of at least a first predetermined amount.