The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Nov. 26, 2008
Applicants:

Shuzo Hirata, Tokyo, JP;

Akinobu Ono, Tokyo, JP;

Inventors:

Shuzo Hirata, Tokyo, JP;

Akinobu Ono, Tokyo, JP;

Assignee:

Fujikara Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.


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