The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Mar. 13, 2008
Jun-heyoung Park, Suwon-si, KR;
Jee-soo Mok, Yongin-si, KR;
Ki-hwan Kim, Suwon-si, KR;
Sung-yong Kim, Suwon-si, KR;
Jun-Heyoung Park, Suwon-si, KR;
Jee-Soo Mok, Yongin-si, KR;
Ki-Hwan Kim, Suwon-si, KR;
Sung-Yong Kim, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.