The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Aug. 28, 2009
Jung Hwan Chun, Chungcheongnam-do, KR;
Gyu Han Kim, Gyeonggi-do, KR;
Jung Hwan Chun, Chungcheongnam-do, KR;
Gyu Han Kim, Gyeonggi-do, KR;
Abstract
Provided is a method of dicing a wafer that is thin and includes a low-K material using plasma without causing chipping and cracking during sawing without using an etch mask and without performing a separate wafer coating process. The method includes recognizing scribe lines of a front side of the wafer by using an image recognizing unit to obtain recognition information, performing two etching processes, wherein at least one includes plasma etching, on a backside of the wafer by using the recognition information to separate the wafer into a plurality of semiconductor chips, and adhering the plurality of semiconductor chips to an extended tape or a die attach film.