The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Feb. 26, 2009
Applicants:

Jae-seob Lee, Suwon-si, KR;

Dong-un Jin, Suwon-si, KR;

Yeon-gon MO, Suwon-si, KR;

Tae-woong Kim, Suwon-si, KR;

Inventors:

Jae-Seob Lee, Suwon-si, KR;

Dong-Un Jin, Suwon-si, KR;

Yeon-Gon Mo, Suwon-si, KR;

Tae-Woong Kim, Suwon-si, KR;

Assignee:

Samsung Mobile Display Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); H05H 1/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of the metal substrate satisfies an equation as follows, Erepresenting Young's modulus of the buffer layer, vrepresenting Poisson's ratio of the buffer layer, αrepresenting a coefficient of thermal expansion of the buffer layer, and αrepresenting the predetermined coefficient of thermal expansion of the metal substrate.


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