The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Jun. 22, 2007
Applicants:

Jeong Hyun Kim, Gyeonggi-do, KR;

Choong Keun Yoo, Gyeonggi-do, KR;

Kang Ju Lee, Gyeonggi-do, KR;

Inventors:

Jeong Hyun Kim, Gyeonggi-do, KR;

Choong Keun Yoo, Gyeonggi-do, KR;

Kang Ju Lee, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 9/26 (2006.01); H01J 9/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

An organic electro-luminescence display device includes a thin film transistor on a first substrate, where the thin film transistor has a drain region and a common electrode connected to the drain region. An organic electro-luminescence diode resides on a second substrate, where the organic electro-luminescence diode includes a spacer covered with a diode electrode. First and second sealant materials reside at a periphery of the first and second substrates, where the first sealant material surrounds the thin film transistor and the organic electro-luminescence diode, and the second sealant material surrounds an outer perimeter of the first sealant material. The first and second substrates are bonded together, such that the common electrode of the thin film transistor contacts the diode electrode of the organic electro-luminescence diode. The bonding process is carried out by sequentially sealing the first sealant material and the second sealant material.


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