The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2012

Filed:

Oct. 30, 2009
Applicants:

Todd F. Miller, Scottsdale, AZ (US);

Yizhen Lin, Gilbert, AZ (US);

David J. Monk, Mesa, AZ (US);

Woo Tae Park, Chandler, AZ (US);

Inventors:

Todd F. Miller, Scottsdale, AZ (US);

Yizhen Lin, Gilbert, AZ (US);

David J. Monk, Mesa, AZ (US);

Woo Tae Park, Chandler, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01); G01P 3/04 (2006.01); G01P 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectromechanical systems (MEMS) sensor device () includes a sensor portion () and a sensor portion () that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (). The sensor portions () can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (). The sensor portion () includes one or more sensors (), and the sensor portion () includes one or more sensors (). The sensors () are located inside the chamber () facing the sensors () also located inside the chamber (). The sensors () are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.


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