The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Mar. 07, 2008
Akihiko Sano, Uji, JP;
Hiroto Nozawa, Yokohama, JP;
Naru Yasuda, Uji, JP;
Hayami Hosokawa, Kyoto, JP;
Akihiko Sano, Uji, JP;
Hiroto Nozawa, Yokohama, JP;
Naru Yasuda, Uji, JP;
Hayami Hosokawa, Kyoto, JP;
OMRON Corporation, Kyoto, JP;
Abstract
An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.