The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Oct. 12, 2010
Patrick Y. Law, Cupertino, CA (US);
James B. Keller, Redwood City, CA (US);
R. Stephen Polzin, San Jose, CA (US);
Patrick Y. Law, Cupertino, CA (US);
James B. Keller, Redwood City, CA (US);
R. Stephen Polzin, San Jose, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
A memory device having a scalable bandwidth I/O data bus includes a semiconductor die having a substrate with a first and a second surface. The substrate includes contact pads arranged in rows across the first surface and across the second surface. The contact pads on one surface may be physically arranged in vertical alignment with a corresponding contact pad on the other surface and may be electrically coupled to the corresponding contact pad using a via. The substrate also includes a metallization layer formed on the second surface. The metallization layer includes external data contact pads each arranged in vertical alignment with a respective contact pad on the second surface. Each row of contact pads may be grouped, and the external contact pads within a group are electrically coupled to an adjacent contact pad on the second surface by effectively logically shifting to them to right one contact pad.