The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Dec. 15, 2010
Seok-chan Lee, Seoul, KR;
Min-woo Kim, Seoul, KR;
Seok-Chan Lee, Seoul, KR;
Min-Woo Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A multi-chip package is provided. The multi-chip package includes: a first semiconductor chip including first circuitry, a first chip terminal in communication with the first circuitry, a first surface, and conductor means for transmitting at least one of a signal and power; a second semiconductor chip attached above the first surface of the first semiconductor chip, the second semiconductor chip including second circuitry and a second chip terminal in communication with the second circuitry; and an electrical connection connecting the second chip terminal of the second semiconductor chip to the conductor means of the first semiconductor chip; wherein the conductor means is dedicated to the second semiconductor chip and does not transmit either a signal or power to or from the remainder of the first semiconductor chip.