The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Jun. 03, 2010
Hiroki Yamamoto, Hitachi, JP;
Takashi Naito, Funabashi, JP;
Takuya Aoyagi, Hitachi, JP;
Yuuichi Sawai, Anan, JP;
Takahiko Kato, Hitachinaka, JP;
Hiroki Yamamoto, Hitachi, JP;
Takashi Naito, Funabashi, JP;
Takuya Aoyagi, Hitachi, JP;
Yuuichi Sawai, Anan, JP;
Takahiko Kato, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A wiring member comprising a substrate, a copper wiring layer having an electrical resistivity of not larger than 4×10Ωcm in directly or indirectly contact with the substrate, an aluminum diffusion layer, contiguous to the copper wiring layer, having an aluminum concentration gradient descending towards the inside, and an aluminum oxide layer contiguous to and covering the aluminum diffusion layer, wherein a ratio of a thickness of the copper wiring layer to a thickness of the aluminum diffusion layer is 1.5 to 5. The disclosure is also concerned with a method of manufacturing the wiring member and an electronic device.