The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Feb. 13, 2009
Takuto Yasumatsu, Osaka, JP;
Takuto Yasumatsu, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A production method for a flexible semiconductor substrate according to the present invention includes: a step of providing an inorganic substrate; a step of forming a polyimide layeron the inorganic substrate by using a material in solution form, the polyimide layerhaving a thickness of less than 10 μm; a step of forming a semiconductor device on the polyimide layer; a step of, after forming the semiconductor device, removing the polyimide layer from the inorganic substrate; and a step of forming a polyparaxylene resin layerhaving a thickness which is equal to or greater than the thickness of the polyimide layer. The polyparaxylene resin layer may be formed on the semiconductor device before the removing step, or formed on the opposite side of the polyimide layer from the semiconductor device after the removing step. The production method according to the present invention excels in mass producibility.