The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Jan. 30, 2006
Yuichi Ito, Ichihara, JP;
Yugo Yamamoto, Chiba, JP;
Kimihiko Saito, Chiba, JP;
Mitsu Chemicals, Inc., Minato-Ku, Tokyo, JP;
Abstract
The bonding method of the present invention is a method of bonding a member (a) having a layer (a) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a). The composite film of the present invention is, firstly, a composite film formed with a laminate having a layer (a) comprising an organic polymer (A) and a layer (c) comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom; secondly, a composite film formed with a laminate having the layer (a), the layer (c) and a layer (b) comprising an adhesive resin (B) disposed in this order, wherein the layer (c) and the layer (b) are directly laminated; and thirdly, a composite film formed with a laminate having the layer (a), the layer (c), and a transparent conductive layer (d) disposed in this order, wherein one outermost surface or both outermost surfaces of the composite film are partially formed with the layer (c).